The demand for semiconductor assembly & testing services is growing due to rising demand for electronics equipment by the customers. Therefore, companies are investing more in the production of new electronic products in the market. The Semiconductor Assembly & Testing Services (SATS) market is based on Service. The approach is SATS platform is designed on the basis of entire code being executable as a single function.The regional segmentation of [FURL=https://www.marketresearchfuture.com/reports/semiconductor-assembly-testing-services-market-2415]Semiconductor Assembly and Testing Services Market[/FURL] segments the market into North America, Europe, Asia Pacific, and the rest of the world (RoW). During the forecast period, the Asia Pacific is expected to emerge as the fastest growing market. The factors driving the market growth in this region, growing demand for electronic equipment by the customer and increasing market presence of leading players. For the consumer electronics industry, China is the biggest market. For the semiconductor industry, Japan is the biggest market. For the telecommunication industry, India is the biggest market. Some other Asian countries where the key players of this market have a presence include Singapore and Taiwan.
North America is the second largest market. The factors that are driving the market in this region include increasing manufacturing of consumer electronics equipment demanding assembly and packaging services, and presence of semiconductor assembly and testing services. In the United States of America (USA), many key players in this market have the bases of operations. That is why the market in the USA is strong. Europe market is expected to witness positive growth during the forecast period, especially in the strong economies like France and the United Kingdom (UK).
Key Players
The key players in the global SATS market include Advanced Semiconductor Engineering, Inc. (the USA), Amkor Technology, Inc. (the USA), CORWIL Technology (USA), Chipbond Technology Corporation (USA), Global Foundries (USA), Integrated Micro Electronics Inc. (USA), Powertech Technology Inc. (Taiwan), Siliconware Precision Industries Co., Ltd. (Taiwan), and STATS ChipPAC Ltd (Singapore).
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