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Eeja (tanaka Precious Metals) To Exhibit At 37th Internepcon Japan
Premiering new plating products for electronic components, semiconductors, and resins in the fields of communications and in-vehicle devices to meet rising needs in the electronics industry, 1/24/2023 - TOKYO, Jan 25, 2023 - (JCN Newswire) - EEJA Ltd. (Head Office: Hiratsuka-shi, Kanagawa; Representative Director & Group CEO: Toru Shoji; hereafter "EEJA"), which operates TANAKA Precious Metals' plating business, announced today that it would exhibit at the 37th INTERNEPCON JAPAN, the electronics packaging and manufacturing exhibition to be held at Tokyo Big Sight on January 25-27, 2023. Exhibiting at INTERNEPCON JAPAN for the first time in four years, EEJA will premiere four new products related to plating technologies and processes. Together, they will help meet rising needs in the electronics industry, such as expanded data bandwidth in communications environments and improved durability of in-vehicle electronic components and semiconductors.

SEADCAT200 series

This will be EEJA's first exhibition at INTERNEPCON JAPAN since 2019, and the technologies in demand have become increasingly sophisticated in recent years. The main usage domain for electronic components has shifted from local to network usage, while the communications industry has shifted to 5G (5th generation mobile communication systems) to support increased data volumes and faster speeds. The automotive industry has also changed, with the increased use of electronic components and semiconductors around the engine and subsequent demand for products able to pass testing in harsh environments in terms of characteristics such as heat and moisture resistance.

Taking advantage of precious metals technologies acquired by TANAKA Precious Metals over many years in the industry, EEJA develops and provides the plating technologies and products that are essential in the electronics industry, from semiconductors to electronic components. To meet the diverse and ever-changing needs of customers, the company is constantly researching and developing new plating characteristics and high-productivity processes tailored to each application. EEJA will exhibit four new plating technologies at INTERNEPCON JAPAN, together with plating equipment capable of handling increasingly high-density wafers. With the increasing demand for greater sophistication in the electronics industry, these new offerings not only meet diverse needs but will contribute to further technical innovations as well.

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